Simulation and Verifi cation of Temperature and Current Density Distribution of BGA Package Solder Joint

薛明阳; 卫国强; 黄延禄; 姚健

doi:10.16080/j.issn1671-833x.2011.17.006

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Simulation and Verifi cation of Temperature and Current Density Distribution of BGA Package Solder Joint

更新时间：2026-04-17

- Simulation and Verifi cation of Temperature and Current Density Distribution of BGA Package Solder Joint
- Aeronautical Manufacturing Technology Vol. 54, Issue 17, Pages: 75-77(2011)
- 作者机构：
  
  华南理工大学机械与汽车工程学院
- 作者简介：
- 基金信息：
- DOI：10.16080/j.issn1671-833x.2011.17.006
  CLC：
- Published：2011
- 稿件说明：
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薛明阳，卫国强，黄延禄，姚健. BGA 封装互连焊点温度及电流密度分布的模拟与验证[J]. 航空制造技术, 2011, 54(17): 75-77/93.

薛明阳, 卫国强, 黄延禄, et al. Simulation and Verifi cation of Temperature and Current Density Distribution of BGA Package Solder Joint[J]. Aeronautical Manufacturing Technology, 2011, 54(17): 75-77.
薛明阳，卫国强，黄延禄，姚健. BGA 封装互连焊点温度及电流密度分布的模拟与验证[J]. 航空制造技术, 2011, 54(17): 75-77/93. DOI： 10.16080/j.issn1671-833x.2011.17.006.

薛明阳, 卫国强, 黄延禄, et al. Simulation and Verifi cation of Temperature and Current Density Distribution of BGA Package Solder Joint[J]. Aeronautical Manufacturing Technology, 2011, 54(17): 75-77. DOI： 10.16080/j.issn1671-833x.2011.17.006.

摘要

芯片互连焊点承受的电流密度越来越大，给电子产品的服役可靠性带来了新的挑战。本文利用有限元软件对 BGA 封装互连焊点内温度及电流密度分布进行了模拟分析，结果表明：互连焊点的芯片端和基板端存在很大的温度差，在本模拟条件下，最大温度梯度可达到 5.38×103K/cm ；在焊点的电流入口∕出口处存在电流拥挤，其电流密度比平均电流密度大 2-3 个数量级。并和实际测量的焊点温度进行了比较，模拟分析与实际器件温度测量结果吻合较好。

Abstract

The current density in the interconnecting solder joint is increased signifi cantly

which brings new challenges to the reliability of electronic products. Finite element software is used to simulate the distribution of temperature and current density in BGA package solder joints

the numerical simulation results show that there is a great temperature difference between chip side and substrate side of solder joints

the maximum temperature gradient reaches 5.38×103K/cm

the current crowding exists at the entrance/exit of current in solder joints

the current density is 2-3 orders of magnitude higher than the average one. Meanwhile

the results of simulation are also compared with the well-designed experiment

which are in good agreement with the actual experimental ones.

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