Laser Micro-Holes Machining Technology and Its Application

YANG Lijun; KONG Xianjun; WANG Yang; DING Ye; ZHANG Hongzhi; CHI Guanxin

doi:10.16080/j.issn1671-833x.2016.19.032

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Laser Micro-Holes Machining Technology and Its Application

更新时间：2025-10-30

- Laser Micro-Holes Machining Technology and Its Application
- Aeronautical Manufacturing Technology Vol. 59, Issue 19, Pages: 32-38(2016)
- 作者机构：
  
  哈尔滨工业大学机电工程学院,哈尔滨,150001
- 作者简介：
- 基金信息：
- DOI：10.16080/j.issn1671-833x.2016.19.032
  CLC：
- Published：2016
- 稿件说明：
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杨立军，孔宪俊，王　扬，丁　烨，张宏志，迟关心. 激光微孔加工技术及应用*[J]. 航空制造技术, 2016, 59(19): 32-38.

YANG Lijun, KONG Xianjun, WANG Yang, DING Ye, ZHANG Hongzhi, CHI Guanxin. Laser Micro-Holes Machining Technology and Its Application. Aeronautical Manufacturing Technology, 2016, 59(19): 32-38.
杨立军，孔宪俊，王　扬，丁　烨，张宏志，迟关心. 激光微孔加工技术及应用*[J]. 航空制造技术, 2016, 59(19): 32-38. DOI： 10.16080/j.issn1671-833x.2016.19.032.

YANG Lijun, KONG Xianjun, WANG Yang, DING Ye, ZHANG Hongzhi, CHI Guanxin. Laser Micro-Holes Machining Technology and Its Application. Aeronautical Manufacturing Technology, 2016, 59(19): 32-38. DOI： 10.16080/j.issn1671-833x.2016.19.032.

摘要

随着高端、精密装备的飞速发展，人们对高质量、大深径比微孔的需求越来越紧迫。基于此，介绍了飞秒激光与水导激光两种加工微孔的技术，首先探讨了两种微孔加工技术的原理并且回顾了两种微孔加工技术的研究现状；然后着重讨论了激光工艺参数、打孔方式、加工环境（真空、气体、液体、化学环境）、激光与水束光纤耦合对于高质量微孔加工的影响；最后总结了两种微孔加工技术在航空航天领域的应用以及当前面临的问题。

Abstract

With rapid development of high quality and sophisticated equipment

the demand of high quality

high depth/radius radio micro-holes is more and more urgent. Femtosecond laser and water-jet guided laser drilling technologies are introduced. Firstly

the principles of two kinds of micro-holes machining technologies are discussed and two kinds of micro-holes drilling technology research status are reviewed; Then

the effects of processing mode

laser process parameters

processing environment (vacuum

gas

liquid

chemical environment) and laser beam coupling with water on the micro-hole drilling quality are discussed; Finally

aerospace application of two kinds of micro-hole machining technologies and current problems which we face are summed up.

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