Effects of Trace Element on Properties of Sn–3.5Ag–0.7Cu Lead-Free Solder

KOU Lulu; QU Wenqing; ZHUANG Hongshou

doi:10.16080/j.issn1671-833x.2020.08.087

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Effects of Trace Element on Properties of Sn–3.5Ag–0.7Cu Lead-Free Solder

更新时间：2025-10-30

- Effects of Trace Element on Properties of Sn–3.5Ag–0.7Cu Lead-Free Solder
- Aeronautical Manufacturing Technology Vol. 63, Issue 8, Pages: 87-92(2020)
- 作者机构：
  
  北京航空航天大学机械工程及自动化学院,北京,100191
- 作者简介：
- 基金信息：
- DOI：10.16080/j.issn1671-833x.2020.08.087
  CLC：
- Published：2020
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寇璐璐，曲文卿，庄鸿寿. 微量元素对Sn–3.5Ag–0.7Cu钎料性能的影响[J]. 航空制造技术, 2020, 63(8): 87-92.

KOU Lulu, QU Wenqing, ZHUANG Hongshou. Effects of Trace Element on Properties of Sn–3.5Ag–0.7Cu Lead-Free Solder. Aeronautical Manufacturing Technology, 2020, 63(8): 87-92.
寇璐璐，曲文卿，庄鸿寿. 微量元素对Sn–3.5Ag–0.7Cu钎料性能的影响[J]. 航空制造技术, 2020, 63(8): 87-92. DOI： 10.16080/j.issn1671-833x.2020.08.087.

KOU Lulu, QU Wenqing, ZHUANG Hongshou. Effects of Trace Element on Properties of Sn–3.5Ag–0.7Cu Lead-Free Solder. Aeronautical Manufacturing Technology, 2020, 63(8): 87-92. DOI： 10.16080/j.issn1671-833x.2020.08.087.

摘要

通过在 Sn–3.5Ag–0.7Cu 钎料中添加 In、Ge 和 Ce 等微量元素，探讨其对钎料熔点、抗氧化性、界面化合物厚度以及接头性能的影响。结果表明，微量 In 的加入能够有效降低钎料熔点（5~7℃），但不利于钎料抗氧化性；微量 Ge 与 Ce 加入到 SnAgCuIn 之后可以有效改善钎料的抗氧化性。In、Ge 和 Ce 微量元素的添加可以减少钎料在 Cu 基体界面上产生化合物的概率，且对接头强度影响不大。Sn–3.5Ag–0.7Cu–1In–0.05Ge–0.03Ce 钎料综合性能最好，固液相线分别降低 5.9℃ 和 3.9℃，并且抗氧化性较好，焊后界面化合物厚度相比 SnAgCu 钎料减少 36.6%，时效 20 天后化合物厚度减少 23.0%。

Abstract

By adding the trace elements such as In

Ge and Ce to the Sn–3.5Ag–0.7Cu solder

the effects on the melting point

oxidation resistance

interfacial compound thickness and joint properties of the solder were investigated. The results show that the addition of trace In can effectively reduce the melting point of the solder (5–7℃)

but it is not conducive to the oxidation resistance of the solder. The addition of trace Ge and Ce to SnAgCuIn can effectively improve the oxidation resistance of the solder. The addition of trace elements of In

Ge and Ce reduces the probability of the solder producing compounds at the Cu matrix interface and has little effect on the joint strength. The Sn–3.5Ag–0.7Cu–1In– 0.05Ge–0.03Ce solder has the best overall performance

with a solidus line reduction of 5.9℃ and a liquidus reduction of 3.9℃

meanwhile has good oxidation resistance. The interfacial compound thickness was reduced by 36.6% compared to the SnAgCu solder

and the compound thickness was reduced by 23.0% after 20 days of aging.

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