For wire electrical discharge machining (WEDM) with semiconductor characteristics

including superhigh-thickness cutting

ultra-fine wire cutting

metal matrix ceramic composite cutting

etc.

a theoretical system of EDM with semiconductor characteristics is proposed. The performance of semiconductor characteristics is that the workpiece

wire or both have non negligible resistance

which cannot be treated as equipotential in traditional WEDM. The machining characteristics of high-speed WEDM with semiconductor characteristics are analyzed

and the reasons for the failure of traditional WEDM servo control methods are explained. A method based on current pulse probability detection with higher identification is proposed to judge the machining status between electrodes. To achieve stable cutting for a long time

different servo control strategies should be employed for the positive and negative traveling direction to adapt to the processing conditions with obvious differences in reciprocating traveling-wire mode.