SiC

p

/Al composites play an important role in aerospace

precision instruments and other fields

however

higher cutting force and cutting temperature will appear in the machining process

thus reducing the surface quality and precision of the turning process. In order to explore the effect of ultrasonic elliptic vibration and turning technological parameters on SiC

p

/Al turning

the SiC

p

/Al ultrasonic elliptic vibration finite element turning simulation model was established in ABAQUS

the SiC

p

/Al micro-geometric modeling method was optimized

the turning model was verified and the simulation expe

riment was carried out. The results show that the ultrasonic elliptic vibration turning can effectively reduce the defects such as subsurface damage and surface crack. It is found that with the increase of cutting speed and cutting depth

the main cutting force and cutting temperature of conventional and ultrasonic turning increase; The ultrasonic elliptical vibration technology can effectively reduce the main cutting force and cutting temperature in SiCp/Al turning process. Among the selected parameters

the ultrasonic effect reduces the cutting force the most when the cutting depth is 100 μm and the cutting speed is 200 mm/s; The ultrasonic effect reduces the cutting temperature the most when the cutting depth is 20 μm and the cutting speed is 600 mm/s.