XIE Zhiwen, TAO Haotian, LIU Tianxin, CHEN Yongjun, HU Suying, MA Beiyi. Effect of Al Plating Layer on High-Temperature Oxidation Resistance Behavior of CoCrNiAlY–YSZ–LaMgAl11O19 Dual Ceramic Thermal Barrier Coating[J]. Aeronautical Manufacturing Technology, 2024, 67(4): 58-63.
XIE Zhiwen, TAO Haotian, LIU Tianxin, CHEN Yongjun, HU Suying, MA Beiyi. Effect of Al Plating Layer on High-Temperature Oxidation Resistance Behavior of CoCrNiAlY–YSZ–LaMgAl11O19 Dual Ceramic Thermal Barrier Coating[J]. Aeronautical Manufacturing Technology, 2024, 67(4): 58-63. DOI: 10.16080/j.issn1671-833x.2024.04.058.
Effect of Al Plating Layer on High-Temperature Oxidation Resistance Behavior of CoCrNiAlY–YSZ–LaMgAlODual Ceramic Thermal Barrier Coating
An Al plating layer was deposited on the surface of CoCrNiAlY–YSZ–LaMA dual ceramic coating by arc ion plating (AIP). The high temperature oxidation behaviors of these coatings during the air exposure were comprehensively characterized by using XRD
SEM and EDS. Results showed that LaMA coating without Al plating layer underwent severe volume shrinkage during the oxidation test
which triggered the initiation and propagation of longitudinal micro-cracks. These micro-cracks acted as the internal diffusion channels for O
2
triggering a sustained mass increase tendenc
y
rapid TGO growth and severe elemental diffusion
and consequently resulted in a serious coating fracture. However
the coating with Al plating layer showed better high-temperature oxidation resistance and structural stability. The surface Al layer reacted with O
2
to generate an in situ dense Al
2
O
3
barrier layer during the oxidation process
which prevented or delayed the internal penetration of O
2
and thus resulted in a very slow growth rate of TGO layer. The weight gain of this sample increased slightly from 8.59 mg/cm
2
at 20 h to 9.46 mg/cm
2
at 80 h. These current experimental results provided a new technical way and theoretical vision for the life-extension design of dual-ceramic thermal barrier coatings and the regulation of interfacial thermal growth stress.