Design and Research on Polishing Characteristics of High Speed Pneumatic Polishing Device

CHEN Dengling; PENG Yunfeng; ZENG Xinlong

doi:10.16080/j.issn1671–833x.2019.09.053

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Design and Research on Polishing Characteristics of High Speed Pneumatic Polishing Device

更新时间：2025-10-30

- Design and Research on Polishing Characteristics of High Speed Pneumatic Polishing Device
- Aeronautical Manufacturing Technology Vol. 62, Issue 9, Pages: 53-58(2019)
- 作者机构：
  
  厦门大学航空航天学院,厦门,361102
- 作者简介：
- 基金信息：
- DOI：10.16080/j.issn1671–833x.2019.09.053
  CLC：
- Published：2019
- 稿件说明：
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陈登铃，彭云峰，曾鑫龙. 高转速气驱研抛装置设计及研抛特性研究[J]. 航空制造技术, 2019, 62(9): 53-58.

CHEN Dengling, PENG Yunfeng, ZENG Xinlong. Design and Research on Polishing Characteristics of High Speed Pneumatic Polishing Device. Aeronautical Manufacturing Technology, 2019, 62(9): 53-58.
陈登铃，彭云峰，曾鑫龙. 高转速气驱研抛装置设计及研抛特性研究[J]. 航空制造技术, 2019, 62(9): 53-58. DOI： 10.16080/j.issn1671–833x.2019.09.053.

CHEN Dengling, PENG Yunfeng, ZENG Xinlong. Design and Research on Polishing Characteristics of High Speed Pneumatic Polishing Device. Aeronautical Manufacturing Technology, 2019, 62(9): 53-58. DOI： 10.16080/j.issn1671–833x.2019.09.053.

摘要

针对传统磨削中电主轴体积大和转速低的问题，设计了一种高转速、小体积气驱研抛装置。通过理论计算对轴承承载力进行了分析，并在有限元软件中建立了装置的仿真模型，对装置刚度、固有频率、临界转速等静动态特性进行了分析和校核。在此基础上，采用气驱研抛装置与柔性树脂磨头对某型发动机叶片用硬质合金进行了研抛试验，研抛后工件表面粗糙度Ra 达到1.395μm，研抛效果良好，证明该装置可用于高精度研抛。

Abstract

A high speed and small volume pneumatic polishing device was designed in order to solve the problem that using large volume and low speed of motorized spindle in traditional grinding. The bearing’s load capacity is analyzed by theoretical calculation

and the simulation model of the device is established by the finite element analysis (FEA) software. The static and dynamic characteristics of the device

such as stiffness

natural frequency and critical speed

are analyzed and checked. On this basis

the polishing experiment was carried out with flexible resin grinding tools

and the polishing characteristics of the device were preliminarily studied. The surface roughness of the workpiece is reduced to Ra1.395μm after polishing. The results show that the device can be used for high precision polishing.

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