A copper electroplating process is optimized to realize an effective local protection of non-carburization areas of aeroengine components. The primary

minor parameters of a pulse electroplating copper process are identified and optimized in the present work through orthogonal experiment and range analysis. The copper plating deposited using the optimized pulse process demonstrates an excellent interface adhesion state

with surface morphology

porosity and carburization resistance better than that electroplated using a direct current. The thickness of the copper plating might be decreased to 20μm from 50-70μm using the optimized pulse electroplating copper process

thereby saves the cost and enhance the efficiency of copper electroplating production.