华中科技大学材料成形与模具技术国家重点实验室,武汉,430074
纸质出版:2020
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滕庆,孙闪闪,薛鹏举,史玉升,魏青松. 激光选区熔化/热等静压复合成形 Inconel 718组织与性能研究[J]. 航空制造技术, 2020, 63(13): 53-60.
TENG Qing, SUN Shanshan, XUE Pengju, SHI Yusheng, WEI Qingsong. Study on Microstructure and Properties of Inconel 718 Fabricated by Selective Laser Melting/Hot Isostatic Pressing Hybrid Forming Process. Aeronautical Manufacturing Technology, 2020, 63(13): 53-60.
滕庆,孙闪闪,薛鹏举,史玉升,魏青松. 激光选区熔化/热等静压复合成形 Inconel 718组织与性能研究[J]. 航空制造技术, 2020, 63(13): 53-60. DOI: 10.16080/j.issn1671-833x.2020.13.053.
TENG Qing, SUN Shanshan, XUE Pengju, SHI Yusheng, WEI Qingsong. Study on Microstructure and Properties of Inconel 718 Fabricated by Selective Laser Melting/Hot Isostatic Pressing Hybrid Forming Process. Aeronautical Manufacturing Technology, 2020, 63(13): 53-60. DOI: 10.16080/j.issn1671-833x.2020.13.053.
热等静压(Hot isostatic pressing
HIP)技术能整体成形高性能复杂零件,但该技术存在复杂零件包套制作难、异质包套与粉末制件的界面扩散会降低性能等问题,为此展开了激光选区熔化(Selective laser melting
SLM)/ HIP 复合成形工艺研究。利用 XRD、SEM、EBSD 和拉伸试验表征了复合成形工艺基体 / 界面显微组织和拉伸性能。结果表明,利用 SLM 直接成形 Inconel 718 合金基体中存在明显孔洞和微观裂纹,致密度为 98.3%。合金粉末经 HIP 成形后,基体不存在明显的孔洞和裂纹,但存在明显的原始粉末颗粒边界(Prior particle boundary
PPB)。复合工艺条件下,SLM 成形的 Inconel 718 端基体孔洞和裂纹减少,X–Y 表面熔化道特征消失,各向异性程度降低。同时,合金粉末与 SLM 成形 Inconel 718 之间不存在明显的扩散层,界面由细小晶粒组成,厚度约为 16.7μm。界面的高温强度为 626MPa,拉伸断口表面平直,样品沿着 SLM 态和 HIP 态结合界面处断裂。经固溶 + 时效热处理后,界面结合强度提高到了 990MPa,断口分布在 SLM 成形件一侧。通过分析组织和性能变化规律,验证了利用复合成形工艺制备复杂零件的可行性。
Hot isostatic pressing (HIP) technology can be used to fabricate complex parts with high-performance
however
there are some problems with this technology
such as the difficulty of manufacturing capsule for complex parts and the interface diffusion between heterogeneous capsule and powder
which will harm the performance. For this reason
a study on the selective laser melting (SLM)/HIP hybrid forming process was investigated. XRD
SEM
EBSD and tensile test were used to characterize the matrix / interface microstructure and tensile properties of the hybrid forming process. The results show that there are obvious pores and micro cracks in the matrix of Inconel 718 alloy directly formed by SLM
and the density is 98.3%. After HIP process
the Inconel 718 alloy matrix does not have obvious pores and cracks
but there is obvious prior particle boundary (PPB). Under the hybrid process conditions
the pores and cracks of the Inconel 718 formed by SLM are reduced
the characteristics of the melting track on the X–Y surface disappear
and the degree of anisotropy is reduced. After HIP
there is no obvious diffusion layer between the powder particle and the SLM-formed Inconel 718
and the interface is composed of fine grains with a thickness of about 16.7μm. The 650℃ high temperature strength of the interface is 626MPa. The tensile fracture surface is flat along the SLM and HIP state bonding interface. After solid solution + aging heat treatment
the interface bonding strength is increased to 990MPa
and the fracture is distributed in the SLM forming part. By analyzing the evolution of microstructure and properties
the feasibility of using the hybrid forming process to prepare complex parts is verified.
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