Sapphire wafers are affected by many factors during the lapping machining

In order to improve the surface quality of the sapphire lapping machining

by consideration of the volume distribution and flow uniformity of the lapping liquid

the surface texture of the lapping plate is designed. The finite element method is used to simulate the flow field of the designed lapping plate. At the same time

the stress distribution on the surface of lapping plate was simulated by finite element method. In order to verify the processing performance of the lapping plate

the designed lapping plate is compared with the ordinary lapping plate in the lapping experiment. The results show that the design of Archimedes spiral groove plus radial groove with groove width of 2 mm and groove depth of 1 mm is adopted

the surface roughness of the sapphire wafer reaches 0.210 μm

the surface of the wafer has no damage such as crushing and pits

the effect is significantly better than the ordinary lapping plate

therefore the lapping plate designed in this paper has better machining performance.