肖荣诗,魏佳硕,崔梦雅,黄婷. 电介质表面金属功能图案激光加工技术研究进展[J]. 航空制造技术, 2025, 68(1/2): 22-35. XIAO Rongshi, WEI Jiashuo, CUI Mengya, HUANG Ting. Research Progress on Laser Processing Technology for Functional Metal Patterning on Dielectric Surfaces[J]. Aeronautical Manufacturing Technology, 2025, 68(1/2): 22-35.
XIAO Rongshi, WEI Jiashuo, CUI Mengya, et al. Research Progress on Laser Processing Technology for Functional Metal Patterning on Dielectric Surfaces[J]. Aeronautical Manufacturing Technology, 2025, 68(1/2).
肖荣诗,魏佳硕,崔梦雅,黄婷. 电介质表面金属功能图案激光加工技术研究进展[J]. 航空制造技术, 2025, 68(1/2): 22-35. XIAO Rongshi, WEI Jiashuo, CUI Mengya, HUANG Ting. Research Progress on Laser Processing Technology for Functional Metal Patterning on Dielectric Surfaces[J]. Aeronautical Manufacturing Technology, 2025, 68(1/2): 22-35. DOI: 10.16080/j.issn1671-833x.2025.01/02.022.
XIAO Rongshi, WEI Jiashuo, CUI Mengya, et al. Research Progress on Laser Processing Technology for Functional Metal Patterning on Dielectric Surfaces[J]. Aeronautical Manufacturing Technology, 2025, 68(1/2). DOI: 10.16080/j.issn1671-833x.2025.01/02.022.
The demand for functional metal patterning on dielectric surfaces has been growing rapidly
driven by applications in aerospace
consumer electronics
and flexible sensing technologies. As a mask-free and flexible technique
laser manufacturing provides high precision
non-contact processing
and high efficiency
making it ideal for directly fabricating functional metal patterns on various dielectric surfaces. In recent years
significant progress has been made in this field. This review classifies six primary laser manufacturing techniques for metal patterning on dielectric surfaces into two main categories: top-down and bottom-up approaches. These include laser ablation
selective laser sintering
pulsed laser deposition
laser-induced chemical liquid deposition
laser-induced chemical vapor deposition
and laser-assisted electroless plating. The principles
advantages
and recent developments of each technique are discussed
along with an exploration of the technical challenges and future directions for development in this evolving field.