The life of the blades is affected in varying degrees by traditional micro pore machining techniques like drilling and EDM

which cannot match the requirements of high precision and high quality of the holes due to issues like significant taper

recast layer

and cracks during the machining process. Different from traditional mechanical processing

laser processing micro-holes is a high-precision processing method. However

since the spatter cannot completely expel the pores

a recast layer is formed on the hole wall

which affects the quality of the vias. In this paper

the simulation study of the femtosecond laser processing process of micro-holes is carried out and the morphology changes of the micro-holes from the beginning of ablation to the end of the micro-holes are analyzed

and then by changing different laser parameters

it is concluded that the thickness of the recast layer is affected by the laser power and pulse width

and the thickness of the recast layer can be reduced by increasing the power

but the power cannot be increased indefinitely

which will cause excessive ablation

and the pulse width does not show a simple linear relationship with the thickness of the recast layer. In order to reduce the thickness of the recasting layer

a processing method of reaming is proposed

which is to process micropores that are smaller than the actual requirements

and then expand the holes. It is verified by experiments that reaming can significantly improve the quality of micro-pores.