变形温度和固溶处理制度对一种单晶高温合金再结晶行为的影响

李亚微; 韦富龙; 谢光; 张健

doi:10.16080/j.issn1671-833x.25010025

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变形温度和固溶处理制度对一种单晶高温合金再结晶行为的影响

论坛 | 更新时间：2026-06-16

- 变形温度和固溶处理制度对一种单晶高温合金再结晶行为的影响
- 航空制造技术 2026年69卷第10期页码：47-53
- 作者机构：
  
  中国科学院金属研究所，沈阳 110016
  宝武铝业科技有限公司，三门峡 472199
- 作者简介：
  
  谢光，研究员，博士，主要从事高温合金组织性能研究。
  张健，研究员，博士，主要从事高温合金研发。
- 基金信息：
  
  国家重点研发计划(2021YFA1600603);国家科技重大专项(J2019-VI-0010-0124);国家自然科学基金(52271042;U2241283);中国科学院依托重大科技基础设施的建制化科研项目(JZHKYPT-2021-01)
- DOI：10.16080/j.issn1671-833x.25010025
  中图分类号： V25
- 收稿：2025-03-05，
  
  修回：2025-05-26，
  
  录用：2025-08-14，
  
  纸质出版：2026-05-15
- 稿件说明：
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引文格式：李亚微，韦富龙，谢光，等.变形温度和固溶处理制度对一种单晶高温合金再结晶行为的影响[J].航空制造技术，2026, 69（10）：25010025.

LI Yawei, WEI Fulong, XIE Guang, et al. Effect of deformation temperature and solution heat treatment on recrystallization behavior of a single crystal superalloy[J]. Aeronautical Manufacturing Technology, 2026, 69(10): 25010025.
引文格式：李亚微，韦富龙，谢光，等.变形温度和固溶处理制度对一种单晶高温合金再结晶行为的影响[J].航空制造技术，2026, 69（10）：25010025. DOI： 10.16080/j.issn1671-833x.25010025.

LI Yawei, WEI Fulong, XIE Guang, et al. Effect of deformation temperature and solution heat treatment on recrystallization behavior of a single crystal superalloy[J]. Aeronautical Manufacturing Technology, 2026, 69(10): 25010025. DOI： 10.16080/j.issn1671-833x.25010025.

摘要

对第一代单晶高温合金DD413 进行变形量为 4%，温度为 25～1230 ℃的热压缩试验，同时选择 25 ℃变形样品进行不同制度的固溶处理，

利用体视显微镜、电子背散射衍射（EBSD）和扫描电镜（SEM）研究了变形温度和固溶处理制度对再结晶行为的影响。结果表明：合金在 25～1150 ℃变形时均发生再结晶，其面积分数在 62%～74%之间，诱发再结晶的局部晶粒参考取向差（GROD）临界值小于1°；在1200 ℃和1230 ℃变形时，合金不发生再结晶，其GROD临界值（约为5°）远高于较低温度条件，且几何必须位错（GND）密度较低；合金在1230 ℃下固溶处理后未出现再结晶，随温度升高至1250 ℃，再结晶面积分数逐渐增大。不同固溶处理制度下的再结晶行为差异与γ

′

相和γ

/ γ

′

共晶是否溶解密切相关。

Abstract

Hot compression tests with a deformation strain of 4% were conducted on a first generation single crystal superalloy DD413 at 25-1230 ℃. Additionally

different solution heat treatments were applied to the samples deformed at 25 ℃. The effects of deformation temperature and solution heat treatment on recrystallization behavior were investigated using stereomicroscopy

electron backscatter diffraction (EBSD)

and scanning electron microscope (SEM). The results indicate that recrystallization occurs at 25-1150 ℃. The recrystallized area fraction ranges from 62% to 74% and the critical grain reference orientation difference (GROD) values inducing recrystallization are all below 1°. At 1200 ℃ and 1230 ℃

no recrystallization is observed

accompanied by significantly higher GROD critical values (approximately 5°) and lower geometrically necessary dislocation (GND) densities compared to lower temperature conditions. After solution heat treatment at 1230 ℃

recrystallization is absent. With increasing the solution heat temperature to 1250 ℃

the recrystallized area fraction greatly increases. The differences in recrystallization behavior under various solution heat treatments are closely related to the dissolution of the γ

′

phase and γ

/ γ

′

eutectic.

关键词

Keywords

references

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