1. 华中科技大学智能制造装备与技术全国重点实验室,武汉,430074
2. 华中科技大学机械科学与工程学院先进电子制造中心,武汉,430074
3. 华中科技大学柔性电子研究中心,武汉,430074
纸质出版:2026
移动端阅览
尹浪, 李树川, 余化敏, 等. 柔性电子蒙皮赋能传感器飞行器[J]. 航空制造技术, 2026,69(5).
YIN Lang, LI Shuchuan, YU Huamin, et al. Flexible Electronic Skin Enabling SensorCraft[J]. Aeronautical Manufacturing Technology, 2026, 69(5).
尹浪, 李树川, 余化敏, 等. 柔性电子蒙皮赋能传感器飞行器[J]. 航空制造技术, 2026,69(5). DOI: 10.16080/j.issn1671-833x.25010109.
YIN Lang, LI Shuchuan, YU Huamin, et al. Flexible Electronic Skin Enabling SensorCraft[J]. Aeronautical Manufacturing Technology, 2026, 69(5). DOI: 10.16080/j.issn1671-833x.25010109.
航空航天领域的发展对飞行器性能、安全性和智能化水平提出了更高要求。传统刚性传感器难以实现大规模多物理量的实时原位测量,且大量离散分布的刚性传感器对飞行器结构及其表面流场的影响不可忽略。柔性电子技术的兴起为突破传统传感技术瓶颈带来机遇,其柔性、可共形贴附等特性促进了“传感器飞行器”等新概念的发展。其核心思想是通过在飞行器表面和结构内部署大规模分布式传感网络,实时多模态感知飞行器自身状态和外部环境。本文系统回顾了柔性电子在飞行器表面流动特性传感(如压力、剪应力、气流)、气动力与热感知(如应变、温度)方面的关键原理和代表性器件/ 系统设计;探讨了柔性电子蒙皮在减阻、防除冰、电磁调控等主动驱动领域的应用;结合蓬勃发展的人工智能技术,可实现柔性电子蒙皮功能和智能的扩展。最后,对该领域面临的主要挑战和未来发展方向进行了展望,旨在推动传感器飞行器的具身智能化发展。
Aerospace technology demands ever-higher standards for aircraft performance
safety
and intelligence. Traditional rigid sensors struggle to achieve real-time
in-situ measurement of multifunctional and large-scale sensory signals
and the extensive deployment of discrete rigid sensors has a non-negligible impact on the aircraft’s structure and its surface flow field. The advent of flexible electronics offers a new opportunity to overcome the bottlenecks of conventional sensing technology. Its inherent characteristics— such as being flexible and conformable— have fostered the development of new concepts like the “SensorCraft”. The core principle involves deploying large-scale
distributed sensor networks across the aircraft’s surface and within its structure for real-time
multi-modal perception of both the aircraft’s state and the external environment. This review systematically covers the key principles and representative device/system designs of flexible electronics for sensing surface flow characteristics (e.g.
pressure
shear stress
airflow) and for perceiving aerodynamic forces and thermal conditions (e.g.
strain
temperature). It also discusses the applications of flexible electronic skin in active actuation domains
including drag reduction
anti-/de-icing
and electromagnetic control. Combined with the burgeoning field of artificial intelligence
the functionality and intelligence of flexible electronic skins can be further expanded. Finally
the paper provides an outlook on the main challenges and future directions in this field
aiming to promote the development of embodied intelligence for SensorCraft.
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