The soldering test of gold alloy sheet and silver plated copper wire in conductive ring by using eutectic SnPb solder and self-made InPbAg solder was carried out. The microstructure

compound composition

micro-hardness and mechanical property of the two kinds of soldering joints were compared and analyzed

and the influence of the self-made InPbAg solder on the brittleness of t he joints was discussed. The results show that the SnPb solder / gold alloy interface produces a layered IMC layer

and the composition is brittle intermetallic compounds of AuSn

2

AuSn

4

Ag

3

Sn; IMC layer of InPbAg solder / gold alloy interface is very thin with the composition of AuIn

2

Ag

2

In phase

and their hardness are all lowe

r than that of SnPb joint

which indicates that the brittleness of InPbAg intermetallic compound is relatively low. The mechanical property analysis shows that the mechanical properties of InPbAg joints are relatively stable

SnPb joints are brittle fracture

and InPbAg joints are plastic fracture.