The processing technology of high density metal microchannel heat-sink was studied. Based on UV– LIGA technology

the high density mental microchannel plate with 100μm in width and over 500μm in height was fabricated. Then the microchannel plate and the cover plate were packaged. Aimed at the problem that the sealing surface of the high density mental microchannel heat-sink can not be completely bonded when packaging

a novel method based on transition layer compensation was proposed. In order to meet the requirements of air tightness

a shear experiment was carried out in which the shear strength of silver paste

epoxy resin and solder paste were compared. The result shows that the solder paste has the largest shear strength and effect of surface roughness on the bonding strength was further explored. A metal microchannel heat-sink was fabricated based on above technologies. There is no leakage in 2MPa hydraulic seal test

which satisfies the design requirement.