The performance of microfluidic chip mold is subject to the adhesion strength between electroforming layer and substrate in micro-electroforming process. In order to remedy this defect

a novel

lithograph-based method combining through-mask electrochemical etching and micro-electroforming is presented

by which the nickel double cross microfluidic chip mold with high adhesion has been successfully fabricated. According to experimental studies on process parameters

not only optimal parameters were yielded

but also issues like the failure of interfacial delamination due to pickling and lateral corrosion caused by electrochemical etching were further solved. The interface adhesion strength can be determined by shearing strength between electroforming layer and substrate so that the influence of pickling and etching on interfacial adhesion strength can be analyzed quantitatively. The results of the experiments indicate that the shearing strength after pickling (25℃

20s) and etching(30℃

5min) is increased by 98.5% and 203.6% respectively

compared with that of untreated samples. Furthermore

the shearing strength of samples etched is 53.0% higher than that of samples after pickling treatment. The method presented in this paper can effectively improve the adhesion strength between the electroforming layer and the substrate. Additionally

the service life of microfluidic chip mold can be prolonged.